| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a correction carrier and a polishing device to precisely flatten a polishing surface of a surface plate. <P>SOLUTION: The correction carrier 1 to be used to smoothly polish the polishing surfaces 25a and 27a of the surface plates 25 and 27 of a double-sided polishing device 22 includes through holes 10a, 10b, 10c and 10d formed in the thickness direction. The holes 10a, 10b, 10c and 10d are provided at positions avoiding the center of a main surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
