| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows properly protecting a flexible circuit board from an edge of a metal substrate. <P>SOLUTION: A semiconductor device 1 according to the present invention includes: a metal substrate; a semiconductor element disposed on the metal substrate; and a flexible circuit board that has one end disposed on the metal substrate, is electrically connected to the semiconductor element, and extends outside the metal substrate beyond an edge of the metal substrate. At a portion of the flexible circuit board located on the edge of the metal substrate, a thickness adding member is bonded to a metal substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
