发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component with excellent reliability achieving less penetration of plating liquid, and a manufacturing method for the component. <P>SOLUTION: A multilayer ceramic electronic component includes: a ceramic main body; an internal electrode stacked inside the ceramic main body; and an external electrode including a first external electrode layer formed on the ceramic main body, a second external electrode layer formed on the first external electrode layer, and a third external electrode layer formed on the second external electrode layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013098540(A) 申请公布日期 2013.05.20
申请号 JP20120189749 申请日期 2012.08.30
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 GU HYUN-HEE;KWON SANG HOON;KIM SANG HUK;CHE DA-YONG;CHOI JI NA;PARK JAE YOUNG;LIU CHANG BO;PARK MYUN-CHON
分类号 H01G4/232;H01C7/00;H01C7/10;H01F27/29;H01G4/12;H01G4/30 主分类号 H01G4/232
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