发明名称 |
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component with excellent reliability achieving less penetration of plating liquid, and a manufacturing method for the component. <P>SOLUTION: A multilayer ceramic electronic component includes: a ceramic main body; an internal electrode stacked inside the ceramic main body; and an external electrode including a first external electrode layer formed on the ceramic main body, a second external electrode layer formed on the first external electrode layer, and a third external electrode layer formed on the second external electrode layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013098540(A) |
申请公布日期 |
2013.05.20 |
申请号 |
JP20120189749 |
申请日期 |
2012.08.30 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
GU HYUN-HEE;KWON SANG HOON;KIM SANG HUK;CHE DA-YONG;CHOI JI NA;PARK JAE YOUNG;LIU CHANG BO;PARK MYUN-CHON |
分类号 |
H01G4/232;H01C7/00;H01C7/10;H01F27/29;H01G4/12;H01G4/30 |
主分类号 |
H01G4/232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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