发明名称 ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a rolled copper foil in which when the foil is used as a wiring for printed wiring board even for long time using, any crack in the wiring is not developed; and a copper-clad laminate, flexible printed wiring board and electronic equipment, using the foil. <P>SOLUTION: When a portion having &ge;2&deg; of an azimuthal difference between the crystal orientation obtained by irradiating a measuring point of metallurgical structure of the crystal with an electron beam and the crystal orientation obtained by irradiating a plurality of adjacent measuring points positioned the electron beam by 0.5 &mu;m separating distance around the measuring point, is determined as &Sigma;value in the crystal grain boundary as the crystal grain boundary; the rolled copper foil is the one that the total of the length of the crystal grain boundaries &ge;&Sigma;19 as measured after annealing at 400&deg;C for one hour is 8 cm/mm<SP POS="POST">2</SP>or less. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013095933(A) 申请公布日期 2013.05.20
申请号 JP20110237231 申请日期 2011.10.28
申请人 JX NIPPON MINING & METALS CORP 发明人 OKANO TOMOKI
分类号 C22C9/00;C22C9/02;C22C9/04;C22F1/00;C22F1/08;H05K1/09 主分类号 C22C9/00
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