| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition for a printed board surface mounting component including a polyamide resin whereby, in comparison with a conventional aliphatic polyamide resin, sufficient relative viscosity ηr, a wider moldable temperature range, heat resistance and melt-moldability, and reduction in the number of molding cycles can be achieved and a printed board surface mounting component excellent in chemical resistance, hydrolysis resistance, and fuel barrier properties can be molded without deteriorating low water absorbability; and to provide a printed board surface mounting component obtained by molding the polyamide resin composition and equipped with excellent heat resistance at high temperatures and excellent chemical resistance to various chemicals. <P>SOLUTION: The polyamide resin composition for a printed board surface mounting component includes the polyamide resin (component A). The component A is produced by binding a unit derived from a dicarboxylic acid to a unit derived from a diamine, wherein the dicarboxylic acid includes an oxalic acid (compound a), the diamine includes a 1,6-hexanediamine (compound b) and a 2-methyl-1,5-pentanediamine (compound c), and the molar ratio of the compound b to the compound c is 99:1 to 50:50. <P>COPYRIGHT: (C)2013,JPO&INPIT |
