CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE COMPRISING SAID CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a circuit board, a manufacturing method thereof, and a semiconductor package comprising the circuit board which are capable of efficiently forming, without voids, a molding film which molds an electrical device on a circuit board.

SOLUTION: The circuit board comprises: a base substrate having a device-mounting region on which an electrical device is mounted; a resist pattern which covers the base substrate so as to expose the device-mounting region. The base substrate comprises: an insulating layer; a circuit pattern formed on the insulating layer; and a recess provided in the insulating layer on which no circuit pattern is formed within the device-mounting region.

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