| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging structure of an electronic component which reduces influences of warpage of a substrate on an electronic component. <P>SOLUTION: A packaging structure 1 of an electronic component has: a circuit board 2; an electronic component 3A mounted on one surface 2a of the circuit board 2; and a housing 4 housing the circuit board 2 on which the electronic component 3A is mounted. The electronic component 3A is mounted on an end part 9 on the one surface 2a. The housing 4 adopts the structure including a first pedestal part 11 thermally contacting with at least a part of the one surface 2a which excludes the end part 9 and a second pedestal part 12 which is spaced further away from the one surface 2a than the first pedestal part 11 and thermally contacts with the electronic component 3A through a heat conduction member 21. <P>COPYRIGHT: (C)2013,JPO&INPIT |
