发明名称 MOTHERBOARD WITH HEAT SINK
摘要 A motherboard includes a heat sink, a circuit board forming an electronic element and two latches at opposite sides of the electronic element, and two fixing members. The heat sink includes a base board and a number of rows of spaced fins. Two lows of protrusions are formed on the base board and are respectively located at opposite sides of a row of fins. Each protrusion defines a through hole. Each fixing member includes a clamping portion engaging with one of the latching members, and two engaging portions engaging in the corresponding through holes.
申请公布号 US2013120932(A1) 申请公布日期 2013.05.16
申请号 US201113304390 申请日期 2011.11.24
申请人 TAN LIANG;MA XIAO-FENG;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. 发明人 TAN LIANG;MA XIAO-FENG
分类号 G06F1/20 主分类号 G06F1/20
代理机构 代理人
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