| 摘要 |
A microelectronic element is disclosed that includes a semiconductor chip and a continuous monolithic metallic edge-reinforcement ring that covers each of the plurality of edge surfaces of the semiconductor chip and extending onto the front surface. The semiconductor chip may have front and rear opposed surfaces and a plurality of contacts at the front surface and edge surfaces extending between the front and rear surfaces. The semiconductor chip may also embody at least an active device or a passive device. |
