发明名称 LIGHT EMITTING MODULE, METHOD FOR MANUFACTURING LIGHT EMITTING MODULE, AND VEHICULAR LAMP
摘要 Provided is a light emitting module in which an LED device is mounted and power is supplied to the LED device by a gold wire. The light emitting module includes a first resin (sealing material) that seals the gold wire and a second resin (dam wall) that surrounds at least a portion of the outer peripheral of the first resin. The first resin has a lower viscosity and a lower elastic modulus compared to the second resin, and protects the gold wire mechanically and chemically. The second resin suppresses the first resin from being flowed out toward the peripherals, and, as a result, the sealing state of the gold wire by the first resin may be maintained.
申请公布号 US2013119431(A1) 申请公布日期 2013.05.16
申请号 US201213676187 申请日期 2012.11.14
申请人 KOITO MANUFACTURING CO., LTD.;KOITO MANUFACTURING CO., LTD. 发明人 SUZUKI TETSUYA;MATSUMOTO AKIHIRO;NAKAGAWA TOMOYUKI;SONE NAOKI
分类号 H01L33/52;H01L33/00 主分类号 H01L33/52
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