发明名称 POLYMER RESIN-COPPER COMPLEX, AND PREPARATION METHOD THEREOF
摘要 <p>The present invention relates to a polymer resin-copper complex which comprises i) copper, ii) nickel formed on the copper, and iii) a polymer resin which is treated with a triazine thiol-based derivative and then coupled to the nickel; and the result of X-ray photoelectron spectroscopy (XPS) analysis of the complex is that Ni content is less than 5% of the total content, which includes NiO and Ni2O3. According to the present invention, the complex improves the adhesive force between a metal and a resin, and as for tensile strength, even after thermal shock tensile strength is maintained. In addition, by using nickel and a triazing thiol-based derivative and utilizing methods, such as pretreatment, appropriate surface roughening, heat treatment, surface coating and the like, to increase binding force to a resin, it is possible to provide a metal-resin complex with excellent binding force between a metal and a resin.</p>
申请公布号 WO2012165919(A9) 申请公布日期 2013.05.16
申请号 WO2012KR04372 申请日期 2012.06.01
申请人 TAESUNG POLITECH CO.,LTD.;KOREA BASIC SCIENCE INSTITUTE;JEONG, EUH-DUCK;HAN, HYUN-JU;HWANG, BO-RAM;JIN, JONG-SUNG;HA, MYOUNG-GYU;KIM, HYUN-GYU;HONG, TAE-EUN;HONG, KYONG-SOO;KIM, JONG-PIL;BAE, JONG-SEONG;JUNG, HONG-DAE;LEE, SU-JONG 发明人 JEONG, EUH-DUCK;HAN, HYUN-JU;HWANG, BO-RAM;JIN, JONG-SUNG;HA, MYOUNG-GYU;KIM, HYUN-GYU;HONG, TAE-EUN;HONG, KYONG-SOO;KIM, JONG-PIL;BAE, JONG-SEONG;JUNG, HONG-DAE;LEE, SU-JONG
分类号 B32B15/08;B32B15/20;C23C28/00 主分类号 B32B15/08
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