| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroplating apparatus. <P>SOLUTION: The electroplating apparatus 100 includes: a fixture 120 for fixing a plating object 110; nozzles 150 separately disposed on both sides of the plating object while facing each other and feeding a plating solution to the plating object 110; a shielding membrane 130 disposed between the plating object 110 and the nozzle 150 and formed in a multistep manner; and a fixing part 140 for fixing the shielding membrane 130. <P>COPYRIGHT: (C)2013,JPO&INPIT |
