发明名称 ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To ensure improved waterproofness in a packingless type electronic apparatus. <P>SOLUTION: An electronic apparatus includes: a first housing component member 20A; a second housing component member 30A; a housing part 50A formed in a housing 40A formed by placing the first housing component member 20A in contact with the second housing component member 30A and assembling those members; an inner member 60 disposed in the housing part 50A; and a hollow part 70A which divides a contact boundary surface F between the first housing component member 20A and the second housing component member 30A into a first contact boundary surface F1 where the housing part 50A is provided and a second boundary surface F2 located at the outer edge side of the housing 40A and extends so as to substantially enclose the housing part 50A. Water repellent treatment is done on an inner wall surface of the hollow part 70A. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013093408(A) 申请公布日期 2013.05.16
申请号 JP20110233792 申请日期 2011.10.25
申请人 SHIN ETSU POLYMER CO LTD 发明人
分类号 H05K5/06;G06F1/16;H04M1/02 主分类号 H05K5/06
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