发明名称 |
PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE |
摘要 |
A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change.
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申请公布号 |
US2013122783(A1) |
申请公布日期 |
2013.05.16 |
申请号 |
US201113129351 |
申请日期 |
2011.04.13 |
申请人 |
MENK GREGORY E.;TSAI STAN D.;CHO SANG J.;DHANDAPANI SLVAKUMAR;COCCA CHRISTOPHER D.;FUNG JASON G.;CHANG SHOU-SUNG;GARRETSON CHARLES C.;APPLIED MATERIALS, INC |
发明人 |
MENK GREGORY E.;TSAI STAN D.;CHO SANG J.;DHANDAPANI SLVAKUMAR;COCCA CHRISTOPHER D.;FUNG JASON G.;CHANG SHOU-SUNG;GARRETSON CHARLES C. |
分类号 |
B24B53/017 |
主分类号 |
B24B53/017 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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