| 摘要 |
A process for manufacturing a heat sink structure for a high-power LED, comprising the following steps: forming a first positioning hole and first fixing holes through a PCB; forming a second positioning hole and second fixing holes through a heat-conductive plate; passing fixed columns though the first fixing holes and the second fixing holes, and fixedly connecting the PCB and the heat-conductive plate such that the two form an integral whole; passing a heat-conductive column through the first positioning hole and the second positioning hole, such that the upper end of said column extends beyond the PCB; placing said integral whole on a stamping apparatus for stamping, modifying the length of the extended end of said column. The process allows for an enlarged heat-conductive column cross-section, an interference fit between the column and positioning holes, and an enlarged LED substrate contact area, which facilitates heat conduction.
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