发明名称 DEFATTING METHOD OF BONDING WIRE AND MANUFACTURING METHOD OF COATED BONDING WIRE USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a defatting method of a bonding wire with which sufficient defatting effects can be obtained while preventing a flaw from being generated in the bonding wire subjected to defatting, and a manufacturing method of a coated bonding wire using the same. <P>SOLUTION: A defatting method of a bonding wire for defatting a bonding wire 5 using electrophoresis includes a first defatting step for immersing and passing the bonding wire in a first tub 10 containing a first alkaline solution 30 and provided with an anode 50 for effecting electrophoresis in the first alkaline solution, and a second defatting step for immersing and passing the bonding wire which has passed through the first tub, in a second tub 20 containing a second alkaline solution 40 and provided with a cathode for effecting the electrophoresis in the second alkaline solution. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013093481(A) 申请公布日期 2013.05.16
申请号 JP20110235611 申请日期 2011.10.27
申请人 NIPPON MICROMETAL CORP 发明人 TOGASHI AKIRA;NOGUCHI JINICHI
分类号 H01L21/60 主分类号 H01L21/60
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