EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing an embedded printed circuit board in which a cavity for embedding a chip is formed on an insulating layer configured of a photosensitive film by exposure and development processes.

SOLUTION: The embedded printed circuit board includes: a core layer on which a cavity is formed; a copper foil layer whose top is coated with an adhesive layer for fixing the chip; the chip mounted on the cavity of the core layer arranged on the top of the copper foil layer coated with the adhesive layer; an insulating layer formed between the cavity and the chip and on the top of the core layer; and a circuit layer formed on the insulating layer. The core layer is made of photosensitive compositions including a photosensitive monomer and a photoinitiator.

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