发明名称 |
THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACKAGE WARPAGE |
摘要 |
The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device. |
申请公布号 |
WO2013070207(A1) |
申请公布日期 |
2013.05.16 |
申请号 |
WO2011US59951 |
申请日期 |
2011.11.09 |
申请人 |
INTEL CORPORATION;MALATKAR, PRAMOD;HARRIES, RICHARD J. |
发明人 |
MALATKAR, PRAMOD;HARRIES, RICHARD J. |
分类号 |
H01L23/34;H01L23/12;H01L23/28;H01L23/48 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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