发明名称 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for laser processing which can easily obtain a smooth processed surface of a rotating body. <P>SOLUTION: This laser processing apparatus performs shape forming by irradiating an object to be processed with a laser beam, is equipped with a position adjusting mechanism for adjusting relative positional relation between the object and the laser beam while rotating the object to be processed around an axis; a laser beam irradiation mechanism for irradiating the outer peripheral surface of the object with a focused laser beam; and a control section, where the control section gives the rotation axis O of the object a tilt relative to a virtual surface K orthogonal to the light axis of the laser beam, makes the object rotate in a state that the light axis is arranged in a twisting position with respect to the rotating axis, and performs processing by oscillating the laser beam along the rotating axis while maintaining the distance between the focal position and the virtual surface constant. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013091095(A) 申请公布日期 2013.05.16
申请号 JP20110236098 申请日期 2011.10.27
申请人 MITSUBISHI MATERIALS CORP 发明人 KUBO TAKUYA;HIGANO SATORU;TAKAHASHI MASAKUNI
分类号 B23K26/00;B23K26/04;B23K26/08;B23K26/10 主分类号 B23K26/00
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