| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent glass fibers or resin causing foreign materials from being exposed on an outer periphery of a wiring board. <P>SOLUTION: An exposure device 10 comprises: a table 1 on which a panel A for a wiring board is placed; a press plate 2 that presses and fixes a part of an outer periphery of the panel A for the wiring board on the table 1; and a laser irradiation device 3 that irradiates a laser beam for exposure on the panel A for the wiring board. The press plate 2 is made of a transparent material transmitting a laser beam. By exposing the region under the press plate 2 to light, a conductor layer 12 can be left on the outer periphery of the panel A for the wiring board. Thus glass fibers or resin causing foreign materials are not exposed on the outer periphery of the panel A for the wiring board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
