SOLDERING METHOD AND SOLDERING APPARATUS

摘要

PROBLEM TO BE SOLVED: To improve soldering efficiency and the yield of a semiconductor device after soldering in a soldering method of sticking solder to an electrode of the semiconductor device by soaking the semiconductor device in molten solder filled in a solder tank.

SOLUTION: The soldering method includes applying ultrasonic waves to the liquid surface 12c of molten solder 12A by an ultrasonic transducer 4 disposed on the liquid surface 12c only before soaking the semiconductor device 10 in the molten solder 12A and before pulling the semiconductor device 10 out of the molten solder 12A. The liquid surface 12c is thereby vibrated to allow the molten solder 12A near the liquid surface 12c to overflow to the outside of the solder tank 2.

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