METHODS OF AND SEMICONDUCTOR DEVICE WITH BALL STRENGTH IMPROVEMENT

摘要

PURPOSE: A method for improving ball strength and a semiconductor device are provided to prevent warpage by adding underfill materials between a chip and a substrate. CONSTITUTION: A chip has an active surface. A plurality of connection balls(306) are arranged on the active surface. The connection ball is electrically connected to the chip. A plurality of dummy balls are arranged on the active surface. The dummy ball is not electrically connected to the chip.