A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to reduce a resistive element of a contact interface by widening a contact area between a test terminal and an external terminal of a semiconductor. CONSTITUTION: A base material including a chip mounting unit(3) and a plurality of external terminals is prepared. A semiconductor chip(2) including a plurality of electrode pads(2c) is mounted on the chip mounting unit. The semiconductor chip is electrically connected to a test circuit by connecting the plurality of electrode pads to the plurality of external terminals.