| 摘要 |
A semiconductor light-emitting element mounting module includes a metal conductor plate including anode and cathode terminal contacts on one side, wherein an anode and a cathode of a semiconductor light-emitting element is connectable to the anode and cathode terminal contacts, respectively; a metal thermal radiator member provided separate from the metal conductor plate; and a surface-insulation portion which covers the surfaces of the metal conductor plate and the thermal radiator member while exposing at least a part of the thermal radiator member and the anode and cathode terminal contacts. A clasping member is provided on the surface-insulation portion and projects from the one side of the metal conductor plate. The clasping member can come into contact with a light-receiving member, which receives light that is emitted from the semiconductor light-emitting element.
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