INTERCONNECT DEVICE, ELECTRONIC DEVICE, AND METHOD OF USING A SELF-HEATABLE CONDUCTIVE PATH OF THE INTERCONNECT DEVICE

摘要

An interconnect device (12) having terminal pads (26), a positioning area (13) for arranging a semiconductor element (15) at the positioning area (13), and a plurality of conductive paths (16), wherein at least a subset thereof is prepared for electrically connecting an arranged semiconductor element (15) to at least a subset of the terminal pads (26), wherein a self-heatable one (16H) of the plurality of conductive paths (16) has a total resistance (R) of more than 90 Ohms. An electronic device (10) comprises said interconnect device (12) and a semiconductor element (15) arranged at the positioning area (13) and electrically connected by conductive paths (16) to at least a subset of the terminal pads (26). A self-heatable conductive path (16H) of the interconnect device (12) described above may be used to increase temperature (T) of a semiconductor element (15) by more than 10° K by arranging and electrically connecting the interconnect device (12) to the semiconductor element (15) and by applying voltage (U) to the self-heatable conductive path (16) arranged in the interconnect device (12).