| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a joint structure and a joint method of a member which are stable for bonding of an electronic component and the operation temperature and inhibit warpage and deformation, and to provide a package using the joint structure and the joint method of the member. <P>SOLUTION: A joint structure of a member, which houses an electronic component or allows the electronic component to be placed thereon, includes: a first member; a second member joined to the first member; and a joint part 13 disposed between a joint surface of the first member and a joint surface of the second member. The joint part contains at least one metal, which is selected from tin (Sn), indium (In), and zinc (Zn), and also contains copper (Cu). The content of the metal decreases toward the side of at least one of the first member and the second member, and the content of copper increases along the same direction. <P>COPYRIGHT: (C)2013,JPO&INPIT |
