| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding method of a sapphire substrate which allows for grinding to a predetermined thickness without causing any chipping on the outer periphery. <P>SOLUTION: A grinding method of grinding the ground surface of a sapphire substrate which has the ground surface and a support surface on the reverse side thereof and is provided, on the outer periphery thereof, with a chamfer having an angle of 45 degrees for the ground surface and the support surface, respectively, includes a protective tape sticking step for sticking a protective tape to the support surface of the sapphire substrate, and a grinding step for grinding the ground surface of the sapphire substrate while holding the protective tape side on a holding surface of a chuck table in a grinder. The grinding step ends at a position on the ground surface side separated 50 μm or more from the outer circumferential surface side end of the chamfer formed on the support surface side of the sapphire substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
