| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame, a wiring board and an LED unit capable of preventing temperature rise on an LED chip, which increase the light output and reduces the cost for the LED unit including plural LED chips connected to each other in series. <P>SOLUTION: A lead frame 30 has plural units 33a which includes: a die pad 34 having a pattern 33 for mounting an LED chip, which is supported via a support piece 32 inside of an outer frame 31 of one pitch; a heat sink 35 extending from the die pad 34 so as to enclose the die pad 34; and a lead 36 which is electrically connected to one electrode of the LED chip having the other electrode 11 electrically connected to the heat sink 35. A lead 36 of a unit 33a in the neighboring units 33a is electrically connected to a heat sink 35 of the other unit 33a in series. A cut piece 32b of the support piece 32 is arranged to float from a virtual plane VP including the rear face of the die pad 34. <P>COPYRIGHT: (C)2013,JPO&INPIT |
