| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connector including a plating layer of silver in which precipitation of copper onto the surface is suppressed, and to provide a plating method of silver capable of forming the plating layer simply, and a manufacturing method of a connector to which the plating method is applied. <P>SOLUTION: The connector includes a plating layer of silver containing zinc on a base material of copper or a copper alloy. The plating method of silver forms a plating layer of silver containing zinc on a base material of copper or a copper alloy, by electric plating using a plating liquid containing zinc. The manufacturing method of a connector including a plating layer of silver containing zinc on a base material of copper or a copper alloy includes a step for forming the plating layer by the silver plating method. <P>COPYRIGHT: (C)2013,JPO&INPIT |
