发明名称 SOLDER INSPECTION METHOD AND SOLDER INSPECTION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To determine appropriateness of a soldered portion with high accuracy. <P>SOLUTION: A solder inspection method which inspects a soldered portion 12a in which plural leads 12 extending from a first member adjacent to each other are respectively soldered to a second member, comprises: a step of coloring each lead 12 alternately with a different color; a step of irradiating the lead 12 with light in each color relating to the color of coloring; a step of respectively photographing the soldered portion 12a of each lead 12 to which irradiation is performed with light; and a step of determining appropriateness of the soldered portion 12a on the basis of the photographed image of the soldered portion 12a of each photographed lead 12. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013093350(A) 申请公布日期 2013.05.16
申请号 JP20110232687 申请日期 2011.10.24
申请人 TOYOTA MOTOR CORP 发明人 HIRATA JUNYA
分类号 H05K3/34;G01N21/956 主分类号 H05K3/34
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