| 发明名称 |
MICROELECTRO MECHANICAL SYSTEM ENCAPSULATION SCHEME |
| 摘要 |
A microelectro mechanical system (MEMS) assembly includes a carrier and a MEMS device disposed over the carrier. A buffer layer is disposed over the MEMS device. The Young's modulus of the buffer layer is less than that of the MEMS device.
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| 申请公布号 |
US2013119493(A1) |
申请公布日期 |
2013.05.16 |
| 申请号 |
US201113293917 |
申请日期 |
2011.11.10 |
| 申请人 |
CHOU BRUCE C. S.;FAN CHEN-CHIH;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHOU BRUCE C. S.;FAN CHEN-CHIH |
| 分类号 |
H01L29/84;H01L21/02 |
主分类号 |
H01L29/84 |
| 代理机构 |
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