| 摘要 |
A semiconductor handling system including a vacuum workpiece handling system having a vacuum environment therein, the vacuum workpiece handling system including at least two workpiece handling robotic facilities, a mid-entry station positioned between the at least two workpiece handling robotic facilities, the mid-entry station including vertically stacked load locks, where the at least two workpiece handling robotic facilities are configured to transfer workpieces between the vertically stacked load locks, at least one workpiece loading station connected to the vacuum handling system, and a workpiece delivery system having an internal environment different from the vacuum environment, the workpiece delivery system being configured to transport the workpieces between each of the vertically stacked load locks of the mid-entry station and the at least one workpiece loading station.
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