| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component capable of sufficiently sealing a space. <P>SOLUTION: A mounting structure 1 has a support member 5, plural piezoelectric elements 7 mounted on the support member 5 via a bump 8, and a sealing resin (resin part 9) coating the plural piezoelectric elements 7 together, and tightly sealing a space S between the plural piezoelectric elements 7 and the support member 5. In the plural piezoelectric elements 7, a distance d1 between lower faces 19a of the adjacent piezoelectric elements 7 is larger than a distance d2 between predetermined positions on an upper side than the lower faces 19a (for example, upper faces 19b). Then, the resin part 9 has an interposition part 9e filled at least at one upper side part of a gap W between the adjacent piezoelectric elements 7. <P>COPYRIGHT: (C)2013,JPO&INPIT |
