| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a stack structure of electric components capable of manufacturing a stack structure of electric components with higher quality, high productivity and high yield, and to provide a plane arrangement aggregation of electric components. <P>SOLUTION: A rearrangement chip aggregation 20 is formed by fixing the clearance of chips 10 arranged horizontally with a rearrangement material 22, and the rearrangement chip aggregations 20 are superimposed so that the chips 10 correspond each other and coupled. Consequently, the stack structure of the rearrangement chip aggregations 20 can be manufactured collectively. A stack chip 40 is formed by dissolving the rearrangement material of each rearrangement chip aggregation 20 with a soluble liquid and separating the chips 10 in the rearrangement chip aggregation 20. Mechanical damage on the chip 10 and the joint of the chips 10 due to dicing, and lowering of yield are eliminated. The stack structure of electric components can be manufactured with higher quality, high productivity and high yield. <P>COPYRIGHT: (C)2013,JPO&INPIT |
