| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing apparatus of a semiconductor device, which can mount a semiconductor chip on a mounting body by correcting displacement of the semiconductor chip with respect to a suction tool to achieve improvement in positional accuracy of the semiconductor chip. <P>SOLUTION: A semiconductor device manufacturing method comprises: a step of sticking fast to a semiconductor chip 2 by a suction tool 12; a step of detecting a position of an alignment mark on the semiconductor chip by imaging an infrared image by an infrared camera 13 from a rear face of the semiconductor chip stuck by the suction tool; and a step of mounting the semiconductor chip on a mounting body 3 by correcting displacement of the semiconductor chip with respect to the suction tool on the basis of the position of the alignment mark detected by the infrared camera. <P>COPYRIGHT: (C)2013,JPO&INPIT |
