发明名称 |
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME |
摘要 |
The present invention provides a circuit component that enables satisfactory connection between a substrate and an IC chip and a method of making the same. The circuit component includes an IC chip and a substrate connected to each other using an electrically conductive adhesive containing electrically conductive particles. Bump electrodes and a non-electrode surface are provided on a mounting surface of the IC chip. The non-electrode surface is a portion of the mounting surface other than a portion where the bump electrodes are formed. Electrically conductive particles are placed in a first state between the surfaces of the substrate and the non-electrode surface so as to be in contact with both surfaces. Electrically conductive particles are placed in a second state between the surfaces of both the substrate and the bump electrodes, so as to be more flattened than the first state and dig into the bump electrodes.
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申请公布号 |
US2013120948(A1) |
申请公布日期 |
2013.05.16 |
申请号 |
US201213661322 |
申请日期 |
2012.10.26 |
申请人 |
HITACHI CHEMICAL CO., LTD.;HITACHI CHEMICAL CO., LTD. |
发明人 |
SATO KAZUYA |
分类号 |
H05K1/11;H01L23/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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