| 摘要 |
PURPOSE: A semiconductor package test apparatus and a semiconductor package test method using the same are provided to test a semiconductor package having a solder ball array with pitches below 0.3mm according as the semiconductor package having a solder ball array of micro pitches is arranged, by aligning the semiconductor package using magnetic force. CONSTITUTION: A test circuit substrate(110) tests a semiconductor package having connection terminals electrically. A socket(120) contacts the test circuit substrate and the semiconductor package electrically. A socket guide(130) has an open area defining the circumference of a socket. An insert(140) fixes the semiconductor package so that the semiconductor package is inserted into the open area of the socket guide. A pusher(150) contacts the socket and the semiconductor package by compressing the semiconductor package. An alignment part(160) aligns the semiconductor package in the open area. The alignment part applies magnetic force to an alignment key frame selectively, so that the semiconductor package is aligned in the open area of the socket. |
