| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board having excellent reliability in connection with a semiconductor chip. <P>SOLUTION: An organic wiring board 10 comprises a first build-up layer 31 formed on a substrate principal surface 11 side, in which resin insulation layers 21-23 and a conductor layer 24 are laminated. The conductor layer 24 in an uppermost layer in the first build-up layer 31 includes a plurality of connection terminal areas 41 for flip-chip mounting semiconductor chips, respectively. The plurality of connection terminal areas 41 are exposed on openings 43 of a solder resist 25. Each connection terminal area 41 has a connection region 51 of a semiconductor chip, and a wiring region 52 extending from the connection region 51 in a plane direction and having a width narrower than that of the connection region 51. Solder wettability of a surface of the wiring region 52 is lower than solder wettability of a surface of the connection region 51. <P>COPYRIGHT: (C)2013,JPO&INPIT |
