发明名称 |
Apparatus and Method for Die Bonding |
摘要 |
A die bonding apparatus and a die bonding method are provided, which are capable of simultaneously bonding a plurality of dies from a first placement area onto a substrate disposed on a second placement area. The die bonding apparatus includes a die sucking device which is movably located above the first placement area and a second placement area. The die sucking device includes a plurality of nozzles. The nozzles can suck the dies disposed on the first placement area, and then simultaneously bond the dies onto the substrate.
|
申请公布号 |
US2013122610(A1) |
申请公布日期 |
2013.05.16 |
申请号 |
US201213460901 |
申请日期 |
2012.05.01 |
申请人 |
CHUNG JUN-WEI;LOU WEI-CHENG;WU JUNG-KUN;CHIANG CHUNG-I;WALSIN LIHWA CORPORATION |
发明人 |
CHUNG JUN-WEI;LOU WEI-CHENG;WU JUNG-KUN;CHIANG CHUNG-I |
分类号 |
H01L21/66;B32B38/18;B32B41/00 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|