| 摘要 |
A power module is described. The power module has a first conducting layer, a second conducting layer (on which an electrical circuit is provided), an insulating layer (such as a ceramic) between the conducting layers and a liquid cooling mechanism. The first conducting layer is exposed to the liquid cooling mechanism and is etched (or modified in some other way) in order to increase surface area (thereby increasing the effectiveness of heat removal by the liquid cooling mechanism). The power module is encapsulated to improve mechanical stability. |
