发明名称 |
POLYAMIDEIMIDE RESIN, SEAMLESS PIPE BODY, COATING FILM, COATING FILM PLATE, AND HEAT-RESISTANT COATING MATERIAL |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyamideimide resin that can form a coating film and a seamless pipe body excellent in tear strength and elongation at break. <P>SOLUTION: The polyamideimide resin is obtained by reacting: (a) a polycarboxylic acid component that makes a trivalent or more polycarboxylic acid anhydride having an acid anhydride group and a carboxyl group an essential component; (b) 2,2'-dimethyl-4,4'-diaminobiphenylimide dicarboxylic acid shown by the formula; and (c) an aromatic polyisocyanate compound, in a basic polar solvent. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013091679(A) |
申请公布日期 |
2013.05.16 |
申请号 |
JP20110232800 |
申请日期 |
2011.10.24 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
YOTSUYA SEIICHI |
分类号 |
C08G18/34;C08G73/10;C09D7/12;C09D179/08 |
主分类号 |
C08G18/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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