发明名称 POLYAMIDEIMIDE RESIN, SEAMLESS PIPE BODY, COATING FILM, COATING FILM PLATE, AND HEAT-RESISTANT COATING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamideimide resin that can form a coating film and a seamless pipe body excellent in tear strength and elongation at break. <P>SOLUTION: The polyamideimide resin is obtained by reacting: (a) a polycarboxylic acid component that makes a trivalent or more polycarboxylic acid anhydride having an acid anhydride group and a carboxyl group an essential component; (b) 2,2'-dimethyl-4,4'-diaminobiphenylimide dicarboxylic acid shown by the formula; and (c) an aromatic polyisocyanate compound, in a basic polar solvent. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013091679(A) 申请公布日期 2013.05.16
申请号 JP20110232800 申请日期 2011.10.24
申请人 HITACHI CHEMICAL CO LTD 发明人 YOTSUYA SEIICHI
分类号 C08G18/34;C08G73/10;C09D7/12;C09D179/08 主分类号 C08G18/34
代理机构 代理人
主权项
地址