| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a yield ratio when peeling off an imprint material in which a pattern has been solidified from a mold by preventing a pattern from being broken and/or a film in a foundation substrate from peeled off. <P>SOLUTION: This is a pattern forming apparatus that transcribes a pattern by contacting a pattern-formed mold 103 with an imprint material 102 on a processed surface of a processed substrate 101. The apparatus includes: a gripping part 3 for gripping the mold in an angle-adjustable way; a displacement part 2 for moving the gripping part so that the mold can contact with the imprint material on the processed substrate or can be demolded; and a control part for making variable a release speed of the displacement part at mold release and at least one of mold release conditions including a mold release angle between the mold and the processed substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
