发明名称 |
RADIO FREQUENCY PACKAGE ON PACKAGE CIRCUIT |
摘要 |
A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package. The first radio frequency package includes radio frequency components. The radio frequency package on package (PoP) circuit also includes a second radio frequency package. The second radio frequency package includes radio frequency components. The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.
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申请公布号 |
US2013122833(A1) |
申请公布日期 |
2013.05.16 |
申请号 |
US201213677054 |
申请日期 |
2012.11.14 |
申请人 |
QUALCOMM INCORPORATED;QUALCOMM INCORPORATED |
发明人 |
HADJICHRISTOS ARISTOTELE;SAHOTA GURKANWAL SINGH;CICCARELLI STEVEN C;WILDING DAVID J;LANE RYAN D;HOLENSTEIN CHRISTIAN;SHAH MILIND P |
分类号 |
H05K3/36;H04B1/40;H05K13/04 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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