| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a back sheet with a back contact circuit which allows for simplification of manufacturing process, stabilized production and manufacturing cost reduction. <P>SOLUTION: The manufacturing method of a back sheet with a back contact circuit having a wiring pattern of metal foil formed on a back sheet consisting of a plastic film includes a step 40 for irradiating a carrier film 31 having a photosensitive adhesive layer at least on one side with an ultraviolet ray from the carrier film 31 side through a mask 9 on which a non-wiring pattern is formed, a step for bonding a metal foil 33 to the photosensitive adhesive layer, a step 40 for irradiating the entire surface with an ultraviolet ray from the carrier film side, a step for bonding the back sheet to the rear surface of the metal foil via an adhesive, and a step 39 for peeling the carrier film from the back sheet. <P>COPYRIGHT: (C)2013,JPO&INPIT |
