HEAT DISSIPATION SUBSTRATE AND ELEMENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipation substrate which is excellent in heat dissipation and is free from peeling and short-circuiting.

SOLUTION: The present invention provides the heat dissipation substrate which comprises a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer and is characterized in that the insulating layer is made of a non-thermoplastic polyimide resin and has a thickness within a range of 1-20 μm.

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