| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrolytic copper plating bath and a method therefor. <P>SOLUTION: The copper plating bath contains a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposits copper on the surface of a conductive layer. Such a plating bath deposits a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. <P>COPYRIGHT: (C)2013,JPO&INPIT |
