| 摘要 |
A light emitting diode package structure includes a substrate, LED bare chips and a lens. The substrate has an upper surface, a lower surface and a side surface between the upper surface and the lower surface. The upper surface is provided with a circuit pattern. The side surface is provided with a groove. The LED bare chips are fixed on the upper surface and electrically connected with the circuit pattern. The lens covers the LED bare chips, the upper surface and the circuit pattern by an injection molding process so as to be inserted into the groove. With this arrangement, the connecting strength between the substrate and the lens can be enhanced, thereby achieving waterproof and anti-electrostatic effects. Further, material cost of the present invention is reduced greatly.
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