PURPOSE: A bonding device and a bonding method are provided to prevent the warpage of a panel and the contraction of an anisotropy conduction material due to vacuum by using a vacuum channel. CONSTITUTION: A panel(200) is placed in a base plate(100). A bonding head(400) is located in the upper part of the base plate. A bonding head transfers a driving chip(500) to the upper part of the panel and compresses the driving chip. A vacuum part(120) passes through the base plate. Suction pressure is supplied to at least one vacuum channel(122) of the vacuum part.
