| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring circuit board which improves the adhesion of a ground layer to a first insulation layer or to a second insulation layer. <P>SOLUTION: In a suspension substrate with a circuit 1, a first ground opening 78 is formed on a first base insulation layer 3, and a second ground opening 80, corresponding to the first ground opening 78, is formed on a second base insulation layer 5. The first ground opening 78 is enclosed by the second ground opening 80 and a ground layer 6 fills the first ground opening 78 through the second ground opening 80 so as to contact with an upper surface of a metal support layer 2. Alternatively, the first ground opening 78 encloses the second ground opening 80, the second insulation layer 5 fills a peripheral end part of the first ground opening 78, and the ground layer 6 fills the second ground opening 80 so as to contact with the upper surface of the metal support layer 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
