| 摘要 |
<p>A manufacturing process of a high-power LED radiating structure includes steps of: (1) preparing a PCB board, a heat conducting plate which is provided with a heat conducting pole on its one side and a heat dissipating plate; (2) providing in the PCB board a locating hole passing through both sides of the PCB board, welding a copper plate layer on one side of the PCB board, and welding an electrode weld pad on the other side of the PCB board, and then applying soldering paste on the surface of the copper plate layer; (3) inserting the heat conducting pole into the locating hole from one side of the PCB board which is provided with the copper plate layer, and welding the copper plate layer and the heat conducting plate through reflow soldering; (4) placing the assembled heat conducting plate and the PCB board acquired in step (3) on a stamping equipment, to adjust the height of the heat conducting pole; and (5) fixedly engaging the upper side of the heat dissipating plate with the other side of the heat conducting plate. The inventive process is simple, and the manufactured dissipating structure is advantageous for a simple construction and good heat conducting and dissipating effects.</p> |
